- Material number: 402071
- 1GB CL2.5 PC-2700 (DDR 333) in COB Technique
- DDR-SDRAM component base: MICRON MT46V32M8T36A
- 200-pin 64-bit Small Outline Dual-In-Line. Double Data Rate synchronous DRAM Module for industrial applications
- 0°C to +70°C operation
- Organization: 128M x 64
- Transfer Rate: 2.7 GB/s
- 4 Year Warranty
- ROHS compliant
This Swissbit module family is industry standard 200-pin 8-byte Double Data rate synchronous SDRAM Small Outline Dual-In-line Memory Modules (SO-DIMMs), which are organized as x64 high speed memory arrays designed for use in non-parity applications. These SO-DIMMs are assembled in Chip-On-Board Technology. The passive devices and the EEPROM are SMD components.
The SO-DIMMs use optional serial presence detects (SPD) implemented via serial EEPROM using the two-pin-I2C protocol. The first 128 bytes are utilized by the SO-DIMM manufacturer and the second 128 bytes are available to the end user.
All Swissbit SO-DIMMs provide a high performance, flexible 8-byte interface in a 67.6 mm long footprint. All modules of the extended temperature grade have seen special tests during the manufacturing process to ensure proper operation according to the field of operation as stated in the environmental conditions.
Chip-On-board (COB) technology involves mounting DRAM or Flash semiconductor die directly on a substrate without the need of a packaged component. Eliminating the FBGA or TSOP component package reduces the required substrate area and assembly weight. The saving in area can be as much as 20% in some cases. Using conventional printed circuit boards (PCBs) and standard wire bonding technology, COB technology can yield up to a factor of 5 in weight and volume reduction. COB technology also reduces the number of interconnects between an active die and the substrate (i.e., the package pins), which improves the overall circuit speed, leads to higher clock rates, better electrical performance and improved signal quality and increases the overall reliability of the module. A coating of an Epoxy encapsulent (or Glob Top) is applied that hermetically seals and protects the die and the wire bonded interconnections. The Glob Top also acts like a heat spreader between dies, improves heat emission, adds low coefficients of thermal expansion (CTEs), and provides a hermetically sealed module assembly. The die is glued directly to the PCB and provides for increased heat dissipation from the die through the PCB. Swissbit encapsulates the semiconductor die onto the PCB as a total module package, the complete assembly is extensively temperature tested as a unit, not separate components prior to SMT assembly. This also enables Swissbit to offer its line of COB modules in four temperature grade levels.
Note: sometimes referred to as SDN12864S4B52MT-60CR (the added C is for commercial temperature)